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Semiconductor expert Kim Woo-pyeong has been hired away from Apple to run Samsung’s new processor packaging solution center.
Samsung’s Packaging Solution Center is part of the company’s wider Device Solution America (DSA) operations in Silicon Valley. According to Business Korea, it has now added a specialized packaging solution division, led by ex-Apple Woo-pyeong. In this context, packaging refers to the materials used to to fabricate a processor that is ready to be fitted into a device’s motherboard.Business Korea reports that Samsung is focusing on what it calls enhanced packaging, in order to surmount unspecified physical limitations.
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